Twelve terms from the spec sheets and the earnings calls.
- CUDA core
- One of the thousands of small arithmetic units on an Nvidia GPU; CUDA is also the software platform that programs them.
- Streaming multiprocessor (SM)
- The GPU's building block: 128 cores, four tensor cores, a scheduler, registers and shared memory. An H100 has 132.
- Tensor core
- A unit that multiplies small matrices in a single clock. Nearly all of a neural network's arithmetic runs through them.
- FLOPS
- Floating-point operations per second. A teraflop is a trillion; a petaflop a thousand trillion. Always check the precision and whether sparsity is assumed.
- Warp
- A group of 32 threads that execute the same instruction together on 32 cores.
- HBM
- High-bandwidth memory: DRAM dies stacked and wired through each other, sitting beside the die on the package. 80 GB on an H100, 192 GB on a B200.
- CoWoS
- TSMC's packaging that puts the die and the memory stacks on one silicon interposer. Its capacity has set how many GPUs could be built.
- NVLink
- Nvidia's chip-to-chip link: 900 GB/s per H100, 1.8 TB/s per Blackwell GPU, so a rack of them can share memory.
- Precision (FP16, FP8, FP4)
- How many bits each number uses. Fewer bits mean roughly double the throughput per halving, at some cost in accuracy.
- Memory wall
- When a chip waits for data rather than computing. Generating text one token at a time is almost always memory-bound.
- TDP
- The chip's design power: 700 W for an H100, about 1,000 W for a B200. It sets the cooling and the electricity bill.
- Accelerator
- Any chip built mainly for AI maths: Nvidia and AMD GPUs, Google's TPUs, Amazon's Trainium, Microsoft's Maia.